https://www.youtube.com/watch?v=DVTxHx0z-wo
Learn how to reball and solder Xilinx IC without BGA stencil. Watch the video and follow the steps.

https://hackaday.com/2023/03/23/working-with-bgas-soldering-reballing-and-rework/
Place the correct stencil inside the top part of the jig, then align it until the holes in the stencil line up exactly with the pads on the chip. Next, take some sticky tape and close off all

https://www.youtube.com/watch?v=Jow-D4HdXCc
In this video, I am reballing without a stencil an 0.8mm pitch 100pins BGA chip.Tools that I use: Hot Air Station: https://www.banggood.com/custlink/KDGm7y06

https://www.youtube.com/watch?v=ipPZSYl7acs
#repair #righttorepair #microsolderinghttps://thecod3r.live/pcbwayPCBWay is the leading provider of custom printed circuit boards, flexible printed circuit b

https://electronics.stackexchange.com/questions/504492/is-it-possible-to-hand-solder-a-bga-without-solder-balls
1. The advantage of solder balls or stencils is the right amount of solder in the right spot. I wouldn't do this by hand or "pin to board" on a BGA, too big of a chance of shorts, cold joints, incomplete soldering, or other. The only way to inspect it is via x-ray or smoke test... - Ron Beyer.

https://electronics.stackexchange.com/questions/608162/bga-reballing-and-reflowing-how-to-actually-repair-dead-gpu-chips
The melting point of the internal (flip-chip) package to die solder is a higher melting point than the external balls. This allows the BGA to be soldered in the first place. So it can be re-balled and used again, once it's been tested, without disturbing the die attach. Which brings me to the most common use of reballing: failure analysis.

https://www.deskdecode.com/reballing/
Let's dive into the world of BGA (Ball Grid Array) Chip Reballing—a fancy fix for those chips that have seen better days thanks to their worn-out or damaged solder balls. Imagine these solder balls as the chip's trusty sidekicks, bridging the gap between the chip and its circuit board, making sure those electrical connections stay golden.

https://www.solder.net/blog/mastering-art-of-bga-chip-reballing/
BGA reballing is a process that involves removing an existing BGA chip from a printed circuit board and replacing it with a new one. This process is often used in electronic repair to fix faulty BGA chips or upgrade a device's performance. The reballing of BGA chips requires precision and expertise to ensure that the new chip is appropriately

https://www.semiconductorpackagingnews.com/uploads/1/The_Essential_Guide_for_High-Reliability_BGA_Component_Re-balling.pdf
for solder sphere attachment when re-balling BGAs and other area array devices such as land grid arr ay (LGA) and quad flat pack, no leads (QFN) devices including solder paste deposition, or using tacky flux and replacement solder spheres. BGA component re-balling services are a vailable for BGA devices with a pitch as fine as 0.35 mm pitch.

https://www.circuitrework.com/features/1040.html
Introduction. This paper provides a comprehensive overview of the challenges and best practices associated with the reballing process of Ball Grid Array (BGA) components. The paper explores the complexities involved in removing and replacing solder balls on BGAs, emphasizing the criticality of achieving high-reliability connections.

https://www.eevblog.com/forum/beginners/getting-started-with-bga-reflow-and-reballing/
Re: Getting started with BGA reflow and reballing ... « Reply #6 on: June 28, 2014, 08:07:26 pm ». Ok, but during the reflow process I guess that the pre-heater should bring the temperature up to at least 180°C. Then the top heater should bring it up to at least 220°C for a few minutes during the peak of the reflow process.

https://toolboom.com/en/articles-and-video/bga-reballing-and-installation/
Reballing is a process of putting all of the pins on the BGA, after it was removed from a PCB with the help of an appropriate soldering station. As a result, if the chip works it may be used again, if not then the pins are put on the new chip that works. Two factors play an important role in the success of reballing:

https://www.solder.net/blog/seven-steps-to-perform-bga-reballing-process/
Evenly spread the flux with a soft brush till it forms uniform thickness. Attach the Preform Ball. Place the preform ball on the PCB. Ensure that the preform lines align to the patterns on the device. Place Device on Top of the Preform. You need to attach the BGA component to the ball array perform. Ensure that the pattern orientation is correct.

https://www.circuits-central.com/blog/the-dos-and-donts-of-bga-reballing/
This includes considerations like the type of solder paste or underfill used, the type and thickness of stencil for placing the BGA balls, and other general equipment tolerances. To learn more about BGA reballing service in Toronto, give us a call at 1 (888) 602-7264, fill out our contact form, or email us at info@circuits-central.com.

https://www.instructables.com/Simple-BGA-Reballing/
If you want to have someone perform the reballing service then contact BEST Inc . Simple BGA Reballing: This instructable will use the solder preform process to teach you how to reball a plastic BGA in about 10 minutes or less. You will need: 1. Reflow source (reflow oven, hot air system, IR system) 2. Paste flux (water soluable is preferred) 3.

https://www.soldertools.net/bga-reballing/
There a variety of methods one can use for low volume reballing requirements (less than a few hundred pieces). One can use the following methods for BGA chip reballing: Use micro stencils for holding the balls and printing the paste or flux on to the device. Use a preform which is a single piece preform where the balls are captured in the

https://www.pcb-repair.com/resources/common-bga-rework-mistakes/
Next, remove the residual solder. Have the site fixtures, and then preheat it again with a vacuum to remove the old and excess solder. Reball BGA. Once you have removed all the excess solder, reball the BGA. Reballing involves using a stencil to set new spheres of solder into the BGA. Re-solder and reattach all components.

https://www.instructables.com/Reworkng-a-BGA-Using-a-Stay-in-Place-Stencil/
Step 7: Reflow, Clean, and Inspect. Reflow the part. Afterwards, clean it with isopropyl alcohol and a lint free cloth. Inspect the part for any errors. Reworking a BGA Using a Stay in Place Stencil: BGA rework stencil featuring a stay in place feature to simplify the process and repair damaged solder mask.

https://www.instructables.com/BGA-rework/
Make sure the chip stays out of table, so it can be heated from bottom. Next, take the aluminium foil and the square frame and fix them in position. with the help of the wire clip we made at the beginning. Finally, position the little tin ball in the center of the BGA chip. Make sure the board is horizontal. This will prevet the tin solder ball

https://www.soldertools.net/blog/selecting-the-appropriate-bga-reballing-stencil/
Reballing is the best approach to repair BGA interconnection in this situation. The BGA rework stencil is a crucial tool for making the reballing process more efficient. It's necessary to reball the BGA after it has been taken from the PCB, and this is done with a hot air or IR rework station. The defective chip can be used again, or new

https://support.xilinx.com/s/article/7830?language=en_US
Solution. Xilinx does not recommend any rework/reballing for BGAs. Once the part is removed from the board, Xilinx does not guarantee reliability of the part if it is remounted on the PCB as there is a significant risk associated with component reworking ( i.e. removing the piece from the original board, cleaning residual solder, reballing and

https://www.ifixit.com/Answers/View/166816/How+do+you+know+when+a+device+needs+reballing
Not all BGA Package IC's can be Reballed, this is due to the size and thickness of the BGA IC's. " To reball an individual IC you will know the pattern of the array, the size of the solder balls. Then you will need a stencil, replacement solder balls and a reflow station. You will also need the proper temperature guide to ensure a proper

https://www.electronicsandyou.com/blog/bga-ball-grid-array-repairing-and-soldering-bga.html
Apply paste flux to the bottom ( soldering side) of the BGA package. Carefully place the BGA Package on the solder balls. Preheat and then apply Hot Air with Hot Air Blower from both top and bottom. Solder balls will melt and get soldered. BGA technology and the BGA soldering is very reliable if done using the correct procedure.