00:32

01005 Hand soldering and Rework using solder paste and hot air

02:17

StikNPeel to simplify solder paste application during QFP rework

05:03

StencilQuik for rework of Ball Grid Arrays (BGA) - standard procedure in IPC 7711 5.7.2

03:57

EZReball for Ball Grid Arrays (BGA) - recognized in IPC 7711/21 Procedure 5.7.6.

07:00

Spot the difference - New Year's challenge - Surface Mount Process

00:25

PCB inline aqueous spray-in-air cleaning

00:20

Pin-in-Paste - Connector drop during Intrusive Reflow

00:23

Solder Wetting of Surface Mount IC during Reflow Soldering

00:18

Surface Mount IC Lifted Lead Coplanarity Fault during Reflow Soldering

00:55

Component Placement - Package On Package (PoP)

00:41

Conformal coating of SMT PCBA using automated selective spray machine process

02:49

Electrochemical Migration (ECM) - Dendrite formation / Dendritic growth

07:04

Moisture Sensitivity Level (MSL) - Destructive PCB delamination test

01:40

SMD Component Placement - 240 pin QFP at the end of the video

01:14

Ball Grid Array (BGA) rework - Removal and refit using hot air and flux

01:51

Hand soldering surface mount QFP with solder paste and hot air tool to reflow

04:54

Moisture Sensitivity Level (MSL) for hygroscopic surface mount components

03:00

10 solder paste printing process defects and solutions - under 3 mins!

07:24

Hand soldering surface mount components to IPC class 3

02:25

Replacing surface mount SOIC - SMT rework made simple and easy

04:52

Professional hand soldering surface mount IC's to IPC class 3 - Drag/sweep soldering using flux gel

02:38

Using flux gel, iron with chisel tip and tinned copper wire to remove surface mount components

00:50

Surface Mount Component removal techniques using flux gel

05:14

Surface Mount Process - paste printing/inspection, component placement, reflow soldering & 3D AOI

10:19

Surface Mount Troubleshooting Guide - solder paste printing, component placement & reflow soldering

00:17

Solder Paste Inspection Process - 3D SPI

07:04

ERSA Versaflow 3/45 - Selective Solder Process

00:09

Reflow of surface mount gull wing device - Heel and toe fillet

00:42

BGA reflow soldering process double drop using lead-free solder and RoHS compliant component

00:15

Mid chip solder ball or bead forming under SMT resistor during reflow soldering

01:15

Voids forming under DPAK due to outgassing during solder reflow

00:35

World's Smallest SMD component 008004 - 0.25 x 0.125 mm

00:34

Reflow soldering of QFP leads - Surface Mount Process

00:29

Solder balls forming under chip capacitor due to excessive paste - Surface Mount Process

03:07

EPM software XML file creation from gerber and cad xy for Mirtec 3D AOI - Surface Mount Process

00:46

DPAK soldering and formation of solder ball due to too much paste - Surface Mount Process

00:29

Partial tombstone defect of smd resistor 3D AOI - Surface Mount Process

00:22

3D automated optical inspecion (AOI) showing lifted leads on QFP - Surface Mount Process

00:27

Heel and Toe solder fillet formation on gull-wing device - Surface Mount Process

00:30

BGA soldering and centre during reflow - Surface Mount Process

00:12

Tombstone of chip capacitor during reflow soldering - Surface Mount Process

00:17

Mirtec MV-3U Omni Desktop 3D AOI in action

00:19

Surface mount component placement - Europlacer IIneo in action

03:29

Reflow Soldering - Surface Mount Process

00:12

Reflow Soldering Defect - Chip capacitor tombstone

02:51

SMD Resistor Codes (3 and 4 digit system, EIA-96) - Surface Mount Process

01:55

Moisture Sensitivity Level (MSL) - Surface Mount Process

00:37

Solder Paste Type Comparison - Surface Mount Process

00:33

Solder Paste 3D Inspection (SPI) - Surface Mount Process

02:13

Component Placement - Surface Mount Process

01:55

Solder Paste Printing - Surface Mount Process

00:46

Reflow Soldering of Chip Capacitor - Surface Mount Process

00:51

Selective soldering using pillarhouse orissa synchrodex

01:58

Selective soldering around surface mount components using pillarhouse orissa synchrodex

00:33

Selective soldering around surface mount components using pillarhouse orissa fusion

00:39

Europlacer Express calibration